3.5-inch SBC · 146×102 MM · R100

RP7003AW Industrial Motherboard

12th/13th Gen Core U/P with DDR5 to 96 GB, a PCIe 5.0 M.2 slot and two 40 Gbps Type-C ports — the RP7003AW packs machine-vision compute into a 146×102 mm industrial board.

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RP7003AW · Quick Specs
CPUOnboard Core 12th/13th Gen -U/-P
Memory2× DDR5 SO-DIMM · 96GB
DisplayDP 1.4 · HDMI 2.0 · 2× Type-C (DP)
Network2× Intel i226-V LAN
PowerDC 9–36V · 120W
Temperature−20/+60°C operating
RP7003AW industrial motherboard top view

12TH/13TH GEN U-P · DDR5 96GB · PCIE 5.0 M.2 · DUAL I226-V · DC 9–36V · SAMPLE MOQ 1 PC

Why RP7003AW

Where it outruns the spec sheet

Full Specifications

Technical data

Per the RP7003AW product specification dated 2026.03.16. Verify any value against the datasheet on request.

CPUOnboard Intel Core 12th/13th Generation -U/-P series · EFI BIOS
Memory2× DDR5 SO-DIMM · up to 64 GB (12th Gen) / 96 GB (13th Gen)
Storage1× M.2 2280 (PCIe 5.0 x4) · 1× SATA 3.0 (2-pin 5V power)
Display1× DP 1.4 · 1× HDMI 2.0 · 2× Type-C (DP alt mode, up to 40 Gbps) · 1× LVDS/eDP optional
Network2× Intel i226-V LAN · E-Key WiFi/BT · B-Key 4G/5G or SSD
USB2× USB 3.0 · USB 3.0 + Type-C (DP + 40 Gbps) · Type-C (DP + 40 Gbps) · 2× USB 2.0 headers
Serial6× COM · COM1/2 RS232/RS485 (BIOS selectable) · COM3–6 RS232
Expansion1× E-Key (PCIe + USB 2.0, WiFi/BT) · 1× B-Key (USB 2.0 + USB 3.0 + PCIe, 4G/5G/SSD)
Other I/O8-bit GPIO header · 2× CAN · 4-pin PWM CPU fan · 3-pin system fan
SecurityExternal TPM 2.0 optional (not installed by default)
PowerDC 9–36V · 120 W
Dimensions102 × 146 mm · ~120 g without heatsink · ~220 g with
Environment−20°C to +60°C operating · −40°C to +85°C storage · 5–90% RH, non-condensing
SoftwareWindows 10 · Windows 11 · Linux

Where It Fits

Machine vision and edge computing

The RP7003AW fits where compute, storage and camera data meet on a single industrial board. Typical deployments:

  • Machine vision: PCIe 5.0 NVMe and DDR5 feed inspection pipelines; dual i226-V LAN carries camera streams while COM reaches the PLC.
  • Edge computing gateways: B-Key 4G/5G plus SIM keep cabinets reachable; optional external TPM 2.0 secures the node; DC 9–36 V rides site rails.
  • Panel PCs and kiosks: DP 1.4, HDMI 2.0 and two Type-C drive multi-screen self-service and operator interfaces.
Machine vision inspection line

Configuration

Ordering options

Options are selected at order time; the base board stays standard.

OptionAvailable at order
CPU SKUIntel Core 12th/13th Gen -U/-P series (selectable models)
Panel outputLVDS / eDP (optional)
SecurityExternal TPM 2.0 (not installed by default)

Product Views

More photos of the RP7003AW

Every angle from the product shoot — board face, interfaces and mounting. Click through to see the detail.

RP7003AW industrial motherboard view 6
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RP7003AW industrial motherboard view 10
RP7003AW industrial motherboard view 11

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Tell us the Core generation and TPM requirement, and we’ll quote price, lead time and shipping.

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